With our DEK Horizon 03iX inline stencil printer, it is possible to apply solder paste or SMD adhesive to a wide variety of circuit boards. During the printing process, the squeegee pressure is permanently checked and readjusted automatically.
After this marked areas are inspected, which will be covered after the assembly process, i.e. QFN, BTC or BGA. With the built-in dispenser, additional paste or adhesive dots can be added.
The printed circuit boards can have the following dimensions:
- max: 510 mm x 508.5 mm
- min: 50 mm x 40.5 mm
- Thickness: 0.2mm – 6.0mm